IFC Considers $150M Investment in Salcomp India Expansion
网页2024年4月5日 · Salcomp Tech would use the funds to expand its manufacturing capacity in Chennai. The total project cost is $250 million and IFC is providing a seven-year loan up to $150 million to fund the project. Salcomp Tech is 100% owned by Salcomp Plc, a Finland-based holding company. Salcomp Plc is a wholly owned subsidiary of …
Wiwynn to Build Assembly Plant in Malaysia - Circuits Assembly
网页2021年7月9日 · The company reported 2020 consolidated revenue of NT$186.9 billion (US$6.8 billion), up 14.3% year-over-year. Net profit after tax was NT$8.61 billion, an increase of 39.6% year-over-year. The after-tax profit was 4.6%, which increased 0.8 percentage points. Wiwynn plans to continue to enhance competitiveness of cloud computing products and ...
Using Cross-Sectioning for PCB Assembly Qualification - Circuits …
网页2016年7月1日 · Cross-sectioning can be beneficial to printed circuit board assembly (PCBA) qualification as a means to understand process capability and identify potential design and manufacturing concerns. Cross-sectioning is a destructive method in which a PCBA is cut open to view the raw innerlayers, solder connections or internal component devices.
Circuits Assembly Online Magazine - Home
网页Würth Elektronik's WR-SMA PCB Solderless connector allows for quick and easy assembly without damage to the PCB. Sawa Releases SC-SA1 Stencil Cleaner. Sawa's SC-SA1 pneumatic air-driven fully automatic stencil cleaner is designed to enhance the efficiency and safety of cleaning processes for SMT stencils, prin...
Embedded Passive Technology Materials, Design and Process
网页A summary of resistor material selection, evaluations and duplication of a complex digital design. The concept behind embedded passives technology (EPT) is to fabricate and bury components such as resistors and capacitors (R&C) within the layers of a substrate during its fabrication. 1 EPT drivers include demand for additional functionality at ...
Understanding 3D AOI, What It Is, and What It Isn’t - Circuits …
网页2013年12月1日 · Figure 5. The same part in 3D. Currently, AOI systems come with different levels of 3D coverage for components and solder joints. All 3D systems still offer 2D lighting and 2D inspection. It is for the AOI programmer or the QA department to decide to what extent they’d like to deploy new technology for quality assurance.
网页This amount was applied in the tin/lead experiment. For a no-clean, alcohol flux of 1.5 percent solids, the amount to apply on the test board is: Area board = 100 * 160 mm2 = 24.8 in2. Amount of (wet) flux per board = solid content flux * area * required amount dry flux = 100/1.5 * 24.8 * 0.0016 = 2.645 g.
Tackling Head-in-Pillow Defects with Vapor Phase Reflow - Circuits …
网页Head-in-pillow (HiP) defects are one of the most common issues that affect printed circuit boards containing ball grid array/land grid array (BGA/LGA) packages. These defects can result in costly repairs and reduce a component’s lifespan. HiP defects are compromised solder joints often attributed to undesired environmental factors during the reflow process.
Circuits Assembly Online Magazine - 01005: Size Does Matter
网页2015年2月2日 · The smallest component currently in use is known as an 01005. This is a passive component (resistor, capacitor) possessing extremely small weight and dimensions (FIGURE 1). The device is almost invisible to the naked eye. Its dimensions are 0.4mm in length by 0.2mm in width, with a height that varies …
IPC Releases “J” Revisions to 2 Electronic Assembly Standards
网页Published: 08 April 2024. by Tyler Hanes. BANNOCKBURN, IL – IPC has announced the release of "J" revisions for two standards often used together for the manufacture of electronic assemblies. IPC J-STD-001J, Requirements for Soldered Electrical and Electronic Assemblies is recognized as the sole industry-consensus standard for soldering ...
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