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先进封装新趋势:玻璃基板受捧 加速走向商用
今年以来,玻璃基板作为封装环节的关键材料,成为半导体行业的新热点和新趋势。 消息面上,有报道称英伟达的最新产品GB200采用的先进封装工艺将使用玻璃基板,同时,英特尔、三星、AMD、苹果等大厂都表示将导入或探索玻璃基板芯片封装技术。
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