TAIPEI (Taiwan News) — Taiwan is expected to spend NT$2.37 billion (US$75 million) on 300mm fab equipment over the next three years, according to a SEMI report published Thursday (Sept. 26).

Japan's biggest chip equipment maker plans to hire and train local engineers in or around 2026, with their first task to ...

including US memory maker Micron Technology Inc.’s plan for a $2.75 billion assembly facility. Israel’s Tower Semiconductor ...

Kolkata, Sep 26 (PTI) West Bengal Chief Minister Mamata Banerjee on Thursday said that her government has already identified ...

West Bengal Chief Minister Mamata Banerjee announced the identification of land for India’s first national security semiconductor fabrication plant in collaboration with the US. The project, part of a ...

In the high tech universe, there is a a single common road that top flight companies like Nvidia (NASDAQ: NVDA), Advanced ...

ASML Holding is posed to transition from a transitory year to 59% growth next year, fueled by new fabs and a surge in net ...

Intel has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program. The program is designed to expand the trusted manufacturi ...

Taiwan Semiconductor Manufacturing Company (TSMC) is set to accelerate its AI chip packaging capacity growth, completing its ...

Worldwide, 300mm fab equipment spending is projected to grow by 4% to US$99.3 billion in 2024, and further increase by 24% to US$123.2 billion in 2025, surpassing the US$100 billion level for the ...

Additionally, the DOC through the CHIPS Act has finalized its direct investment to Polar Semiconductor of up to $123 million as the first Funding Opportunity for Commercial Fabrication Facilities.