Murata is expanding its range of multilayer ceramic capacitors (MLCC) with the groundbreaking new GRM188C80E107M and ...
TDK Corporation has extended its EPCOS ERU27M series of SMD high-current flat-wire inductors consisting of an isolated alloy powder core and flat-wire helical winding. As power densities and currents ...
ST Microelectronics’ EVLDRIVE101-HPD is a three-phase extremely compact inverter for brushless motors based on the STDRIVE101 device, in conjunction with the STM32G071KB microcontroller. It can be ...
Printed circuit boards (PCBs) are essential components in most electronic devices. They are sensitive to environmental factors like electrostatic discharge (ESD) and moisture, which can cause ...
UK-based company OMC has launched an H19 fibre-optic shield, compatible with Arduino Uno, to demonstrate how an optical fibre datalink can easily be incorporated into a microprocessor-based design.
SKEG is excited to join forces with The Lion Cage to present a workshop on the intricacies of product development and industrialisation to assist in guiding innovative ventures to scale. This ...
The Renesas RA0E1 group is a basic MCU in the entry line of the RA0 series, offering excellent cost effectiveness and ultra-low power consumption. It delivers up to 32 MHz of CPU performance using an ...
The MAX40109 is a low-power, precision sensor interface SoC that includes a high-precision, programmable analogue frontend (AFE), Analog-to-Digital Converter (ADC), calibration memory, and digital ...
The DFS71 is a digital fibre-optic sensor that is designed to provide reliable detection using plastic fibre-optic light guides. The sensor is an IO-Link compatible sensor with configurable outputs: ...
TSMC is now following Samsung by actively entering development of rectangular PCB packaging technology. Traditionally, wafers are circular, resulting in wastage at the wafer’s round edges. Moving to ...
The constantly increasing number and complexity of assistance and infotainment systems are placing ever greater demands on new vehicle wiring system infrastructure. Rosenberger H-MTD connectors are up ...
Based on a robust platform with optimised thermal conduction, the GHA700F PSU delivers 700 W within a 3 x 5-inch industry footprint. With a power density of 31,1 W per cubic inch, it’s one of the ...